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Breakthrough Research Improves SiC Power ICs | AEI
Flexible 3D System Integration Laboratory has developed low-pressure AG sinter joining technology, improving SiC power semiconductors.
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Breakthrough Research Improves SiC Power ICs | AEI
https://aei.dempa.net/archives/10372
Flexible 3D System Integration Laboratory has developed low-pressure AG sinter joining technology, improving SiC power semiconductors.
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https://aei.dempa.net/archives/10372Breakthrough Research Improves SiC Power ICs | AEI
Flexible 3D System Integration Laboratory has developed low-pressure AG sinter joining technology, improving SiC power semiconductors.
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