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Henkel High Thermal Paste Works with Bare Silicon Die | AEI
Henkel introduces LOCTITE® ABLESTIK® ABP 8068TD high thermal die attach paste. The new product line of pressure-less sintering die attach material is suitable for applications where no die back-side metallization (BSM) is required, although can be used if desired. The adaptability of the material gives semiconductor companies a high thermal conductivity die attach option for
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Henkel High Thermal Paste Works with Bare Silicon Die | AEI
Henkel introduces LOCTITE® ABLESTIK® ABP 8068TD high thermal die attach paste. The new product line of pressure-less sintering die attach material is suitable for applications where no die back-side metallization (BSM) is required, although can be used if desired. The adaptability of the material gives semiconductor companies a high thermal conductivity die attach option for
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https://aei.dempa.net/archives/11844Henkel High Thermal Paste Works with Bare Silicon Die | AEI
Henkel introduces LOCTITE® ABLESTIK® ABP 8068TD high thermal die attach paste. The new product line of pressure-less sintering die attach material is suitable for applications where no die back-side metallization (BSM) is required, although can be used if desired. The adaptability of the material gives semiconductor companies a high thermal conductivity die attach option for
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