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Lam Research Acquires SEMSYSCO, Ups the Ante in Chip Packaging | AEI

Lam Research Corp. has acquired SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment from Gruenwald Equity. With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging. Financial terms of the agreement were not disclosed. Advanced packaging is ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI)



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Lam Research Acquires SEMSYSCO, Ups the Ante in Chip Packaging | AEI

https://aei.dempa.net/archives/11986

Lam Research Corp. has acquired SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment from Gruenwald Equity. With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging. Financial terms of the agreement were not disclosed. Advanced packaging is ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI)



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https://aei.dempa.net/archives/11986

Lam Research Acquires SEMSYSCO, Ups the Ante in Chip Packaging | AEI

Lam Research Corp. has acquired SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment from Gruenwald Equity. With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging. Financial terms of the agreement were not disclosed. Advanced packaging is ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI)

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      Lam Research Acquires SEMSYSCO, Ups the Ante in Chip Packaging | AEI
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      Lam Research Corp. has acquired SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment from Gruenwald Equity. With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging. Financial terms of the agreement were not disclosed. Advanced packaging is ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI)

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      Lam Research Acquires SEMSYSCO, Ups the Ante in Chip Packaging | AEI
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      Lam Research Corp. has acquired SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment from Gruenwald Equity. With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging. Financial terms of the agreement were not disclosed. Advanced packaging is ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI)
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