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imec, AT&S Zero in on Advanced IC Packaging | AEI
The advanced semiconductor packaging approach of imec and AT&S enables low-loss, low-cost and mass-manufacturable PCB, enabling next-gen D-Band applications.
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imec, AT&S Zero in on Advanced IC Packaging | AEI
https://aei.dempa.net/archives/16404
The advanced semiconductor packaging approach of imec and AT&S enables low-loss, low-cost and mass-manufacturable PCB, enabling next-gen D-Band applications.
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imec, AT&S Zero in on Advanced IC Packaging | AEI
The advanced semiconductor packaging approach of imec and AT&S enables low-loss, low-cost and mass-manufacturable PCB, enabling next-gen D-Band applications.
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