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Eliyan Sets New Standard for Chiplet Interconnect | AEI

Eliyan’s tape out confirms the most efficient and flexible UCIe-, BoW-, and UMI™-compatible multi-die solution for standard or advanced packaging.



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Eliyan Sets New Standard for Chiplet Interconnect | AEI

https://aei.dempa.net/archives/23696

Eliyan’s tape out confirms the most efficient and flexible UCIe-, BoW-, and UMI™-compatible multi-die solution for standard or advanced packaging.



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https://aei.dempa.net/archives/23696

Eliyan Sets New Standard for Chiplet Interconnect | AEI

Eliyan’s tape out confirms the most efficient and flexible UCIe-, BoW-, and UMI™-compatible multi-die solution for standard or advanced packaging.

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      Eliyan Sets New Standard for Chiplet Interconnect | AEI
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