3D Chip Stacking Makes AI Hardware 5x More Powerful (Here's How) - Ask Alice

In the relentless pursuit of faster, more efficient computing, 3D chip stacking has emerged as a revolutionary breakthrough, fundamentally transforming how we design and build semiconductor devices. By vertically integrating multiple layers of silicon chips, this technology shatters the traditional two-dimensional limitations that have constrained processor development for decades. Think of it as building a high-rise apartment complex instead of spreading houses across a suburb – it dramatically increases processing power while minimizing the physical footprint. As artificial intelligence and machine learning demands push computing requirements to unprecedented levels, 3D chip stacking offers a ...